DBC Laser Drilling Tshuab

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DBC Laser Drilling Tshuab
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Precision layering, kev puas tsuaj- dawb txiav, ua tiav kev sib cais zoo meej ntawm ceramic thiab tooj liab txheej nrog ± 5μm raug.
Kev faib tawm yam khoom
AlN Laser Tej Tshuab
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Hauj lwm lawm

 

Khoom Taw Qhia

 

 

Peb DBC fais fab module laser txiav thiab drilling tshuab yog cov kev daws teeb meem rau precision laser ua ntawm DBC (Direct Copper Ceramic Substrate) fais fab modules (IGBT, SiC, GaN, thiab lwm yam). Siv high-kev ua tau zoo fiber ntau laser tshuab, nws ua tiav precision txiav, drilling, thiab kho saum npoo ntawm txhuas nitride (AlN), txhuas oxide (Al₂O₃), thiab oxygen- cov txheej tooj liab dawb.

Cov cuab yeej no tam sim no tau siv dav hauv kev tsim cov khoom siv hluav taws xob siab - kawg lub zog xws li lub zog tshiab tsheb hluav taws xob tswj hluav taws xob, photovoltaic inverters, thiab cov khoom siv zaus hloov pauv, pab cov neeg siv khoom txhim kho cov khoom ua tau zoo thiab cov khoom tsim tawm.

 

Nta

Precise Layered Machining

Siv lub ntse laser parameter tswj qhov system rau kev tswj kom meej ntawm kev txiav qhov tob

Ua tiav kev sib cais ntawm cov ceramic thiab tooj liab txheej, tiv thaiv tshav kub- cuam tshuam thaj chaw diffusion (HAZ < 30μm)

Machining raug nce mus txog ± 0.01mm, kom ntseeg tau tias zoo sib xws ntawm lub hwj chim terminals thiab ciam teb qhov ntev

Cov txheej txheem tshwj xeeb tseem ceeb

Crack-Kev Txiav Dawb: Ua tiav micro- tawg- dawb txiav ntawm cov txheej ceramic los ntawm cov cuab yeej tswj pulse tswj tshuab

Selective Etching: Precisely tshem tawm qhov tshwj xeeb ntawm cov txheej tooj liab yam tsis muaj kev puas tsuaj rau hauv qab ceramic

Micro-ntawm Array Machining: Machining 0.1-0.5mm txoj kab uas hla tshav kub dissipation qhov thiab txuas qhov ntawm DBC

3D Contour Machining: Adapts rau cov qauv kauj ruam thiab nkhaus duab ntawm lub zog modules

 

Cov ntaub ntawv technical

 

 

Yam khoom

Parameter

Laser wavelength

1060-1080nm

Laser tso zis zog

150W (yeem)

Max.txiav ntau yam

300 * 300 hli

Txiav thickness

0.2-2mm (nyob ntawm cov khoom siv)

Precision ntawm rov ua qhov chaw ntawm X / Y axis

±3µm

CCD qhov muag pom qhov system

Qhov tseeb qhov tseeb ± 5µm

Kev ceev ceev

0-2500mm / min

Qhov siab tshaj plaws acceleration

1.0G

Machining raug

± 0.01-0.02 hli

Worktable precision

Tsawg dua los yog sib npaug li 0.015mm

Hom kis tau tus mob

linear motor +0.1µm grating kav

Tag nrho lub tshuab fais fab (tsis muaj kiv cua)

Tsawg dua lossis sib npaug li 6KW

Tag nrho qhov hnyav ntawm tag nrho lub tshuab

Txog 1700KG

Sab nraud qhov ntev (ntev * dav * qhov siab)

1400 * 1500 * 1800 hli

(Rau siv)

 

DBC Laser Drilling Tshuab Daim ntawv thov Scenario

 

 

IGBT Fais Fab Modules

Main Circuit Copper Layer Patterning

Precision Txiav ntawm Ceramic Substrate

Thib peb -Tsim Semiconductor Modules (SiC/GaN)

Sib cais ua cov teeb liab thiab fais fab terminals

Tshaj tawm -Packaging Processing of Power Modules

Cim npe nrov: Tuam Tshoj dbc laser drilling tshuab manufacturers, lwm tus neeg, Hoobkas

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