Wafer Laser Txiav & Drilling Tshuab
YCTC Series yog tsim los rau precision wafer txiav, drilling, scribing, thiab hloov kho. Featuring fiber ntau laser, marble precision platform, linear tsav tsav, 0.1 μm grating scale, thiab CCD pom kev tso, nws muab ruaj khov thiab raug ua rau semiconductor thiab advanced ceramic substrates.
Cov ntsiab lus tseem ceeb
1060-1080 nm
Fiber Laser
±3 μm
X/Y Repeatability
0.1 μm
Grating Scale
60m / min
Max. Kev nrawm nrawm
1.0 G
Max. Kev nrawm
400 × 400 hli
Max. Chaw ua haujlwm
Kev ua cov ntawv thov
Wafer Txiav · Wafer Drilling · Laser Scribing · Wafer Hloov Kho
Khoom siv
Monocrystalline Silicon · Polycrystalline Silicon · SiC · Ceramic Substrates · Metallized Ceramics
Technical Specifications
| Yam khoom | Specification |
| Laser wavelength | 1060-1080 nm |
| Laser zog | 150 W, customizable |
| Max. Txiav ntau yam | 400 × 400 hli |
| Txiav Thickness | 0.2-2 hli * |
| X/Y Repeat Positioning Accuracy | ±3 μm |
| Kev ceev ceev | 0-3000mm / min |
| Max. Kev nrawm nrawm | 60m / min |
| Max. Kev nrawm | 1.0 G |
| Worktable Precision | Tsawg dua los yog sib npaug li 0.005 hli |
| Kev sib kis | Linear Tsav + 0.1 μm Grating Scale |
| Tshuab fais fab | Tsawg dua los yog sib npaug li 6 kW |
| Tshuab hnyav | Kwv yees li . 2000 kg |
| Tshuab Dimensions | 1500 × 1600 × 1800 hli |
Txiav thickness nyob ntawm cov khoom siv.
Specifications tuaj yeem kho raws li cov khoom siv thiab kev ua haujlwm. Qhov kawg specifications yuav raug rau lub tshuab configuration.
Tshuab Configuration
Fiber Laser
High beam zoo · Tsawg txij nkawm · Tsawg nqi khiav hauj lwm
Precision Motion System
Marble platform · Linear motor · Tag nrho kaw - voj CNC
Vision System
CCD qhov chaw rau precision wafer thiab ceramic ua
Txheej Txheem
Txiav · Drilling · Scribing · Hloov kho
Daim ntawv thov
| Kev lag luam | Daim ntawv thov |
| Semiconductor | Wafer txiav, drilling, scribing, thiab hloov wafer |
| SiC / Semiconductor Khoom | SiC wafer txiav thiab drilling |
| PCB / Ceramic Electronics | Ceramic Circuit Board txiav, drilling, thiab scribing |
| 3C Electronics | Ceramic substrates, ceramic xov tooj rov qab npog, nruab nrab thav ntawv, cov khoom siv hnav |
| Tshiab Zog | Hnub ci photovoltaic Cheebtsam, automotive sensors, hydrogen roj cell ceramic Cheebtsam |
Hom Wafer Processing Samples
Khawv koob txiav|Wafer Drilling|Hloov kho Wafer|Wafer Laser Scribing
Lub kaw lus tuaj yeem teeb tsa raws li cov khoom siv wafer, thickness, geometry, ua qauv, thiab cov khoom yuav tsum tau ua.
Cov qauv kuaj muaj
Xa koj rau pebwafer khoom, thickness, ua daim duab, thiab yuav tsum taurau laser qauv kuaj thiab cov txheej txheem ntsuam xyuas.
FAQ
Q: Cov ntaub ntawv wafer dab tsi tuaj yeem ua rau YCTC Series?
A: Lub tshuab yog tsim los rau monocrystalline silicon, polycrystalline silicon, silicon carbide (SiC) thiab lwm yam ntaub ntawv wafer substrate. Nws tuaj yeem ua cov khoom siv ceramic thiab metallized ceramic substrates nrog CCD pom qhov chaw.
Q: Dab tsi ua haujlwm muaj nyob?
A: YCTC Series txhawb nqa wafer txiav, drilling, laser scribing, thiab wafer hloov kho, nyob ntawm seb cov khoom, thickness, thiab cov kev xav tau.
Q: Dab tsi wafer thickness tuaj yeem ua tiav?
A: Tus qauv txiav thickness ntau yog 0.2-2 hli, nyob ntawm cov khoom thiab nws cov yam ntxwv ua. Lub peev xwm tiag tiag tuaj yeem lees paub los ntawm kev sim ua qauv.
Q: Koj puas tuaj yeem kuaj peb wafer ua ntej yuav khoom?
A: Yog. Peb muab cov qauv laser kuaj thiab cov txheej txheem ntsuas. Xa peb koj cov khoom siv wafer, tuab, ua cov duab kos, thiab cov kev xav tau, thiab peb pawg neeg tsim khoom tuaj yeem ntsuas qhov tsim nyog laser teeb tsa thiab kev ua haujlwm tsis zoo.
Cim npe nrov: Tuam Tshoj wafer laser txiav & drilling tshuab, Tuam Tshoj wafer laser txiav & drilling tshuab manufacturers, lwm tus neeg, Hoobkas
