Alumina ceramic (Al₂O₃) yog siv dav hauv cov khoom siv hluav taws xob, cov khoom siv hluav taws xob, cov khoom siv hluav taws xob, thiab cov khoom siv hluav taws xob zoo vim nws qhov siab tawv, rwb thaiv tsev hluav taws xob zoo heev, thiab siab - kub tsis kam. Txawm li cas los xij, ib txwm siv tshuab machining feem ntau ua rau chipping thiab cracking, ua laser tsis yog -hu rau kev ua ib qho kev daws teeb meem rau micro- qhov fabrication nyob rau hauv advanced ceramics.
Yog li, yuav ua li cas me me ntawm lub qhov tuaj yeem ua lub laum hauv alumina ceramic?
Siv lub Yuchang LaserYC-TC01 Ceramic Laser Ua TshuabRaws li ib qho piv txwv, ib tug pa infrared fiber ntau nanosecond laser (1064 nm) tuaj yeem ua tiav qhov tsawg kawg nkaus txoj kab uas hla ntawm kwv yees li 50 μm ntawm alumina ceramics nyob rau hauv qhov zoo tagnrho. Txawm li cas los xij, qhov kev txwv no feem ntau ua tiav tsuas yog ntawm cov khoom siv ceramic nyob ib ncig ntawm 500 μm tuab. Rau cov substrates thicker dua 500 μm, ruaj khov kev lag luam los ntawm - qhov taub feem ntau yog li ntawm kwv yees li 80-200 μm.
YC-TC01 koom ua ke laser txiav, drilling, thiab scribing ua haujlwm rau hauv ib lub platform. Cov qauv kev teeb tsa muaj xws li: Laser zog: 150 W, Pulse dav: 50-200 ns, Qhov loj me: 50 μm. Lub kaw lus yog tsim los rau cov khoom siv tawv thiab nkig siab heev xws li alumina, silicon nitride, thiab zirconia. Nws tuaj yeem ua tiav cov khoom lag luam ruaj khov ntawm φ50-80 μm los ntawm qhov hauv cov txheej txheem ceramic, ua rau nws tsim nyog rau cov ntawv thov uas xav tau siab precision, yooj, thiab kev ua haujlwm zoo.
Lub tshuab ua tau zoo tshwj xeeb tshaj yog nyob rau hauv me me -batch thiab ntau- ntau qhov chaw tsim khoom.
Rau cov phiajcim tuab dua 3 hli, qhov dav ntawm lub qhov taub nce mus txog kwv yees li φ200-500 μm, thaum lub qhov taper yuav pom ntau dua thiab qhov tawm txoj kab uas hla yuav me dua.
UV Laser Drilling puas tuaj yeem ua tiav siab dua?
UV laser (355 nm) kev ua haujlwm yog ua los ntawm qhov txias ablation thiab "peeling-hom" cov khoom tshem tawm. Thaum tshav kub kub- thaj tsam cuam tshuam tuaj yeem txo mus rau kwv yees li 10-50 μm, uas yuav luag tsis muaj txheej txheem rov ua dua.
Vim tias qhov chaw tsom qhov loj tuaj yeem raug txo kom txog li 20 μm, UV laser tshuab tuaj yeem ua tiav qhov ruaj khov me me los ntawm - qhov nyob hauv alumina ceramics thaum txo qis thermal puas, ntug chipping, thiab microcracks.
Infrared fiber ntau nanosecond lasers (1064 nm) feem ntau muaj qhov loj me me thiab muaj zog thermal cuam tshuam. Nyob rau tib lub sijhawm drilling, qhov kev pheej hmoo ntawm ntug chipping thiab tawg yog siab dua piv nrog UV laser tshuab.
Yog li ntawd, txawm hais tias nanosecond fiber ntau lasers (1064 nm) tsis muaj zog dua li UV nanosecond lasers hauv alumina micro- qhov muaj peev xwm ua tau zoo, lawv tseem muaj cov txiaj ntsig tseem ceeb suav nrog tus nqi qis, kev ruaj ntseg siab, thiab kev saib xyuas yooj yim dua.
Yam tseem ceeb cuam tshuam rau lub qhov taub
1. Focused Spot Size (Qhov Tseem Ceeb Tshaj Plaws)
Txij li UV lasers muaj lub wavelengths luv dua li infrared lasers (1064 nm), lawv tuaj yeem ua tiav cov me me tsom thiab yog li tsim nyog rau micro- qhov drilling. Ua ke nrog siab -precision galvanometer systems thiab dynamic focusing optics, positioning precision tuaj yeem ncav cuag ± 2 μm, ua kom ruaj khov ntawm lub qhov taub ntawm ib ncig ntawm 40 μm.
2. Khoom Thickness & Qhov tob
Nyias ceramic substrate (<1 mm): Easier to process small through-holes with higher yield rates
Thick ceramic substrates (>2 mm): Qhov txoj kab uas hla yuav nce nrog qhov tob tob
For deep holes (>5 mm), qhov tsawg kawg nkaus ua tiav txoj kab uas hla yog feem ntau nyob ib ncig ntawm 100 μm, thaum taper tswj tau nce ntxiv.
3.Kev ua haujlwm tsis zoo
Tib -pulse Spot Drilling: Lub qhov taub loj dua; ntug loj chipping (Ntau tshaj los yog sib npaug rau 100 μm). Rotary Txiav / Helical Scanning: Qhov tsawg tshaj plaws thiab qhov sib npaug; tsawg taper (txoj kev nyiam rau txoj kab uas hla ntawm φ50-80 μm).
Hwj chim: Lub zog siab dhau los ua rau lub qhov taub loj dua thiab ntug chipping; tsis tshua muaj zog tiv thaiv kev nkag mus rau tag nrho. Cov theem fais fab yuav tsum tau ua tib zoo sib xws rau cov khoom siv ua tiav.
Scanning ceev:Kev nrawm dua ua rau lub qhov taub me me; ceev ntawm 200–400 mm/s tawm los siab -zoo los ntawm - qhov.
Pab Gas: Oxygen ua raws li kev pabcuam combustion; nitrogen muab cua txias. Ob lub gases cuam tshuam qhov tshwm sim ntawm lub qhov taub thiab ntug zoo.
4.Alumina Purity
99% Dense Alumina: Cov txheej txheem nyuaj dua; ua rau lub qhov taub loj dua thiab muaj kev cuam tshuam ntau dua rau kev tawg.
96% Porous Alumina: Cov txheej txheem yooj yim dua; txhawb kev tsim cov - qhov me me.
Summary & Equipment Recommendations
Kev siv ntau lawm (nqi ua ntej)
Nanosecond fiber ntau lasers raug pom zoo rau kev ruaj khov ntawm 50 μm micro- qhov ntawm 0.5-2 hli ceramic substrates, muab qhov sib npaug zoo ntawm tus nqi thiab kev ntseeg tau.
Precision Applications (Quality Priority)
UV picosecond lasers raug pom zoo rau 20–50 μm micro- qhov ua haujlwm nrog qhov tsawg kawg nkaus thiab tawg, tshwj xeeb tshaj yog rau ultra- nyias nyias ceramic substrates.
Cov ntawv thov Precision heev (Kev Tshawb Fawb & Siab -End Manufacturing)
Femtosecond laser tshuab tuaj yeem ua tiav 5-10 μm micro- qhov nrog ultra- muaj peev xwm ua haujlwm txias, ua rau lawv tsim nyog rau micro / nano- nplai tsim daim ntawv thov.
YCLASER tshwj xeeb hauv siab- cov cuab yeej laser precision thiab tseem muab kev cog lus ua cov kev pabcuam rau ntau yam khoom tawv thiab nkig. Cov neeg siv khoom txaus siab rau cov ntaub ntawv nyuaj thiab nkig laser daws tau txais tos tiv tauj peb rau kev kuaj dawb thiab kev soj ntsuam xyuas.
