Txhawm rau ua kom tau raws li kev lag luam sib txawv ntawm cov txheej txheem ntawm cov txheej txheem txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheejadvanced ceramicssector cia siab rau peb qhov tseem ceeb ntawm kev ua haujlwm laser:
1. UV Nanosecond Laser Txiav(355nm - Qhov Sib Nqus Mass-Kev Tsim Kho)
Qhov kev teeb tsa no xa cov khoom lag luam zoo tshaj plaws ntawm cov khoom siv thawj zaug ROI, dhau los, thiab tawm los, ua rau nws yog thawj tus neeg ua haujlwm rau cov khoom lag luam hauv tsev.
Core Applications:0.1mm txog 1.0mm txheem AlN thermal substrates, AMB / DBC tooj liab-clad ceramics, 5G RF submounts, hluav taws xob luam yeeb cua sov cov ntsiab lus, thiab tuab - zaj duab xis circuits.
Nws ua haujlwm li cas:Aluminium Nitride nthuav tawm qhov kev nqus siab tshwj xeeb rau luv luv -wavelength 355nm UV teeb. Lub kaw lus siv lub siab -ceev, txheej txheej ntau- dhau kev txheeb xyuas los tswj qhov tob ntawm kev txiav ib kis ntawm qib micron. Ua ke nrog 99.99% siab -purity nitrogen coaxial gas pab, tshav kub- cuam tshuam cheeb tsam (HAZ) thiab thermal stress tsub kom qhov tsawg kawg nkaus.
Standard Production Workflow: CAD File Ingestion ➔ CCD Lub Zeem Muag Auto-Txhim kho ntawm Mark Points ➔ Daim Ntawv Thov Kev Pom Zoo Raws li Substrate Thickness ➔ Siab-Speed Layered Rough Cutting ➔ Contour Fine Trimming ➔ Siab -Kev Ntxub Ntxaug.
Technical Metrics: Siv kev lag luam- qib 5W–15W UV lasers, ntug chipping yog nruj me ntsis tswj nyob rau hauv cov qauv kev lag luam kam rau ua.
2.Ultrafast Femtosecond / Picosecond Laser Txiav(Lub Advanced "Zero-Thermal" daws)
Cov txheej txheem pem hauv ntej hwm no ua tiav cov phab ntsa tshwj xeeb uas muaj qhov zoo sib xws nrog zero subsurface micro- cracking, ua rau nws zoo tagnrho rau cov khoom siv nrog xoom kam rau kev puas tsuaj thaum tshav kub kub.
Core Applications: Semiconductor-qib AlN ib leeg- crystal substrates, sib sib zog nqus UV UVC-LED wafers, thiab siab -tus nqi, txiav-ntug microelectronic Cheebtsam.
Nws ua haujlwm li cas:Siv ultra-short pulses, txoj kev no tso siab rau "ablation-tsav" txheej txheem txheej txheem txias. Lub laser tso lub zog sai heev uas cov khoom vaporizes tam sim ntawd ua ntej tshav kub tuaj yeem ua rau cov ceramic matrix nyob ib puag ncig.
Kev Lag Luam Status:Cov txheej txheem no feem ntau yog tsom mus rau R&D lub chaw soj nstuam, kev tiv thaiv kev lag luam, thiab kev tsim khoom siab tshaj -kawg semiconductor. Vim muaj ntau- lab nyiaj daus las cov cuab yeej siv peev thiab cov kev cai huv huv nruj (tswj qhov kub thiab txias, av noo, thiab plua plav), nws qhov kev siv rau tus qauv, qis- cov paj ntau lawm tseem txwv.
3.QCW Fiber Laser Tej Tshuab (Lub Hnyav-Lub luag haujlwm daws teeb meem rau Coarse & Thick Phaj)
Cov txheej txheem no yog qhov tseem ceeb ntawm lub zog nyoos thiab txiav nrawm, ua kom muaj txiaj ntsig zoo rau cov khoom siv rugged, loj - hom qauv.
Core Applications:AlN rwb thaiv tsev cov khoom siv ntau tshaj 1.0mm tuab, muaj siab -kub crucible sectioning, thiab loj - hom ntawv nyoos ceramic ntawv dicing.
Txheej txheem nta:Characterized los ntawm lub zog siab thiab ceev pub tus nqi. Thaum nws tsim cov kerfs dav dua thiab cov cua sov loj dua - thaj chaw cuam tshuam (HAZ), nws ib leeg - kev nkag mus tau muaj peev xwm tsis sib xws, muab kev ua haujlwm siab tshaj plaws. Cov txheej txheem ua tiav ntawm infrared fiber ntau lasers feem ntau tau txais kev sib tsoo los yog polishing thaum lub sijhawm ua haujlwm ntxhib.
