Aluminium Nitride (AlN) yog cov khoom siv hluav taws xob zoo tshaj plaws nrog cov tawv tawv thiab cov tawv tawv heev. Tsis zoo li cov hlau tsis zoo, sintered AlN tsis tuaj yeem ua los ntawm kev tig, stamping, lossis khoov. Nws yog heev yooj yim mus rau ntug chipping thiab structural cracking nyob rau hauv txhua yam kev nyuaj siab.
Yog li ntawd, mastering tshwj xeeb precision machining-xws li dicing, micro-drilling, thiab nto polishing- yog ib qho tseem ceeb rau kev ua tiav cov khoom siab yields thiab ruaj khov thermal ua haujlwm. Lub ntiaj teb no electronics thiab semiconductor industries feem ntau vam khom plaub core machining txoj kev:
1. Precision Mechanical Sib Tsoo (Standard Shaping)
Qhov no yog lub hauv paus txoj hauv kev rau cov duab geometric yooj yim, tswj thickness, thiab flattening ncej -sintered warpage.
Nws Ua Haujlwm Li Cas: Siab- nrawm, pob zeb diamond-tipped sib tsoo log hlais los ntawm cov tawv ceramic matrix kom tshem tawm cov khoom ntau dhau.
Pros & Cons: Nws muaj kev ruaj ntseg siab thiab tus nqi -kev ua tau zoo rau cov khoom loj, tiaj tus substrates. Txawm li cas los xij, mechanical sib tsoo exerts lub cev hnyav compression, ua rau nws yooj yim rau ntug chipping. Nws tsis tuaj yeem lis cov duab geometry tsis sib xws lossis micro-vias. Kev ywg dej tas mus li yog qhov yuav tsum tau ua kom tsis txhob muaj kev ntxhov siab thermal tawg.
2. Precision Laser Machining(Cov txheej txheem tseem ceeb rau Microstructures)
Laser processing yog kev lag luam- qauv kev daws teeb meem rau dicing, scribing, slicing, thiab complex micro-machining high-end electronic substrates.
Nws Ua Haujlwm li cas: Ib qho tsis yog -kev sib cuag, siab- lub zog laser beam vaporizes cov ntaub ntawv raws li txoj kev programmed yam tsis muaj kev tawm dag zog lub cev.
Pros & Cons: Los ntawm kev tshem tawm txhua yam kev ntxhov siab, laser machining kiag li tiv thaiv micro- tawg thiab ntug chipping. Nws ua tiav micron- theem kam rau ua, ua rau ultra-cov khoom zoo ntawm micro-vias, nqaim slots, thiab tsis xwm yeem contours. Qhov no ua rau nws yog qhov tseem ceeb thev naus laus zis rau huab hwm coj- ua tau siab - ntim ntim semiconductor thiab siab - lub zog IGBT modules.
3. Ultra-Precision Lapping & CMP (Nano-Scale Surface Finishing)
Rau AlN ib zaug -pob zeb siv lead ua substrates thiab qib siab optoelectronic wafers, nto roughness thiab planarity dictate txoj kev vam meej ntawm downstream semiconductor nyias- zaj duab xis epitaxy.
Nws Ua Haujlwm Li Cas: Cov txheej txheem no muab ob npaug -sib cav sib tsoo nrog Tshuaj Txhuam Txhuam Txhuam Txhuam (CMP) siv ultra- pob zeb diamond slurries thiab tshuaj pads.
Pros & Cons: Nws tshem tawm cov sub- deg defects, microscratches, thiab micro-protrusions, txo qhov roughness ntawm lub nanometer nplai (Ra<1mm). This perfect mirror finish ensures uniform epitaxial crystal growth and heavily boosts device reliability.
4. Kev hloov kho deg hauv qab & Metallization
Raws li -machined AlN nthuav tawm qhov chaw siab inertness thiab tuaj yeem raug hydrolysis me ntsis hauv qhov chaw ntub dej. Kev kho deg tshwj xeeb yog siv tom qab-machining los npaj cov khoom siv rau circuitry.
Nws Ua Haujlwm Li Cas: Cov txheej txheem zoo li magnetron sputtering, nqus evaporation, los yog muab tshuaj txhuam sintering siv cov txheej hlau hauv zos rau ntawm cov nplais ceramic (metallization).
Pros & Cons: Qhov kev kho mob no tso cai rau AlN substrate zoo heev solderability thiab xaim - muaj peev xwm sib txuas, hloov cov ceramics raw rau hauv DBC / DPC circuit boards. Nws kuj tso tawm los tiv thaiv -oxidation thiab ya raws- cov ntaub ntawv pov thawj tiv thaiv, ua kom cov khoom siv ua haujlwm ntev nyob rau hauv kev lag luam rugged.
Zuag qhia tag nrho, cov kev sib tw tseem ceeb hauv kev ua cov txhuas nitride yog nyob rau hauv nws cov khoom yam ntxwv -tshwj xeeb nws cov hardness siab, siab brittleness, thiab tsis kam rau kev ua yuam kev- uas yuav tsum tau siv high -precision, tsawg- kev ntxhov siab, los yog txawm tsis yog - kev sib cuag cov txheej txheem.
Kev nce qib tsis tu ncua hauv kev ua cov thev naus laus zis, tshwj xeeb tshaj yog nyob rau hauv precision laser machining, yog tsav lub evolution sai ntawm txhuas nitride los ntawm cov khoom siv nyob rau hauv cov tsoos industrial ceramics mus rau ib tug siv nyob rau hauv high -kawg semiconductor- daim ntawv thov qib.
Nyob rau hauv lub tshav pob ntawm precision machining rau txhuas nitride thiab lwm yam advanced ceramics,YCLASERtsom rau R&D thiab daim ntawv thov siab - laser txiav thiab micromachining technologies.
Hu rau YC LASER hnub notxhawm rau txhim kho koj cov kev ua haujlwm siab tshaj plaws hauv ceramic nrog kev txhim khu kev qha, tus nqi - zoo laser tov.
