Laser dicing ntawm wafers yog ib tug tsis yog -kev sib cuag semiconductor txheej txheem uas siv lasers ntawm tej wavelengths los faib ib tug tag nrho wafers -xws li silicon (Si), silicon carbide (SiC), gallium arsenide (GaAs), los yog lwm yam semiconductor wafers. Cov txheej txheem no yog ib qho kev ua haujlwm siab -lwm txoj hauv kev rau pob zeb diamond pom dicing.
1. Txoj Kev Loj Laser Dicing
UV Laser Stealth Dicing
* Siv 355 nm lossis 266 nm ultraviolet lasers tsom rau hauv wafer los tsim cov txheej txheem hloov kho raws txoj kab kev sau ntawv.
* Lub wafer yog tom qab ntawd sib cais siv cov ntaub nplaum nthuav dav.
* Tsis muaj qhov chaw txiav, chipping, lossis khib nyiab.
* Zoo tagnrho rau ultra-nyias silicon wafers, ntxeev-chip li, thiab nco wafers.
Laser Grooving / Ablation Dicing
* QCW fiber ntau lasers tshem tawm cov ntaub ntawv raws txoj kab kev sau ntawv los ntawm qhov chaw ablation.
* Feem ntau siv rau sapphire, SiC, iav wafers, thiab cov khoom siv hluav taws xob sib xyaw, uas yog qhov yooj yim rau chipping nrog cov pa pom.
Ntsuab / IR Laser Dicing
* Lub hom phiaj thicker silicon wafers, ceramic tooj liab-clad wafers, thiab fais fab wafers.
* Sib npaug txiav kev ua tau zoo nrog siab -cov pob txha zoo.
2. Cov khoom siv Wafer
* Silicon (Si)
* Silicon carbide (SiC)
* Gallium nitride (GaN)
* Gallium arsenide (GaAs)
* Sapphire
* Cov iav wafers
* Alumina ceramic wafers
* MEMS wafers
3. Cov txiaj ntsig tseem ceeb piv rau Saw Dicing
* Tsis yog- txheej txheem tiv tauj: txo cov neeg kho tshuab kev ntxhov siab; ultra-thin wafers (<50 μm) are less likely to crack.
* Cov khoom muaj peev xwm tawv thiab nkig: tuaj yeem ua SiC, sapphire, thiab lwm yam nyuaj - rau - tshuab substrates.
* Qhov dav dav me me: Txuag qhov chaw sau ntawv txoj kab, nce kev siv tau tuag rau wafer.
* Yooj yim txiav txoj hauv kev: Txhawb txoj kev geometries thiab ib feem zawj dicing rau cov qauv tsim tshwj xeeb.
4. Cov ntawv thov ib txwm
* Lub zog semiconductors: IGBT, MOSFET
* LED chips
* Cov khoom siv RF
* MEMS sensors
* Nco chips
* Automotive semiconductor wafers
Hais txog YC Laser
YC Laser tshwj xeeb hauv siab -cov cuab yeej laser precision rau cov ceramics siab heev, semiconductor wafers, thiab lwm yam ntaub ntawv nyuaj thiab nkig. Peb cov kev daws teeb meem npog UV, ntsuab, IR, thiab QCW fiber ntau laser tshuab muaj peev xwm ntawm ultra-thin wafer dicing, micro-grooving, thiab txoj kev nyuaj.
Ntxiv nrog rau kev muab kev txiav- ntug laser tshuab, YC Laser muaj kev cog lus laser ua cov kev pabcuam, suav nrog cov qauv kuaj thiab me me -batch ntau lawm. Cov neeg siv khoom tuaj yeem lees paub lawv cov txheej txheem nrog peb ua ntej nce qib, ua kom muaj txiaj ntsig zoo thiab ua haujlwm siab - cov txiaj ntsig zoo.
Hu rau YCLaser tshawb nrhiav cov kev daws teeb meem laser rau koj cov khoom siv hluav taws xob, MEMS, LED, lossis cov ntawv thov hluav taws xob.
