Ultraviolet Picosecond Laser Tej Tshuab

Ultraviolet picosecond laser txiav tshuab siv lub picosecond ultraviolet laser (<15ps) with a laser wavelength of 355nm. It's suitable for high-speed laser etching, peeling, etching, scribing, dicing, material removal, and fabrication on various material surfaces. Simultaneously, it can perform micro-machining such as scribing and grooving on the surfaces of materials such as silicon wafers, ceramics, sapphire, glass, metals, and polymer materials, meeting the cutting and drilling needs of ultra-thin materials (metals, carbon fibers, glass, silicon wafers, PET, PI, composite materials, etc.). It is the ultimate manufacturing tool for cutting-edge fields such as precision electronics, biomedicine, and scientific research.

Lub ultraviolet picosecond ultrafast laser micro-nano ua cov cuab yeej yog nruab nrog 30W ultraviolet picosecond laser. Nws siv nws tus kheej tsim tswj software los kho cov galvanometer thiab linear motor hauv lub sijhawm. Tom qab importing CAD cov ntaub ntawv, CCD lub zeem muag qhov chaw ua haujlwm tau txais lub laser. Ua ke nrog ib qho ultra-txoj kev txiav txim siab thiab kho qhov muag, kev soj ntsuam thiab kev tswj xyuas ntse, hluav taws xob nqa lub rooj ua haujlwm, thiab qhov tshwj xeeb tshem tawm plua plav, nws ua tiav nyob ze - ua haujlwm zoo.

Qhov zoo ntawm kev siv thev naus laus zis ntawm UV + picosecond: Siab photon zog ncaj qha cuam tshuam cov tshuaj lom neeg cov ntaub ntawv, ua tiav "txias" ua haujlwm; Tsis tshua muaj me me tsom qhov chaw loj, siab nqus rau feem ntau cov ntaub ntawv, tshem tawm carbonization thaum ua; Picosecond mem tes dav (<15ps), heat-affected zone approaches zero, materials are directly vaporized and removed without microcracks, maintaining the original mechanical properties of the material.